Robert W. Keyes
Physical Review B
The mechanistic and parametric complexity of a plasma etching environment often causes confusion and delays in the development of a suitable plasma etching process. This paper is an attempt to alleviate this problem by discussing some of the important physical and chemical phenomena and, where possible, relating these phenomena to apparatus selection and operation. © 1982 Plenum Publishing Corporation.
Robert W. Keyes
Physical Review B
Eloisa Bentivegna
Big Data 2022
P. Alnot, D.J. Auerbach, et al.
Surface Science
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009