Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
Pit growth was studied in 80Ni-20Fe sputtered thin films by analysis of images of the growing pits. The pit current density was found to increase with pit growth potential until reaching a limiting value. The limiting current density increased with decreasing film thickness. The mass-transfer resistance to the active pit wall exceeds by an order of magnitude that predicted from a simple radial-diffusion model. It is suggested that the undercut, remnant passive film collapses over the pit wall causing a constriction. A voltage component calculation matches the data rather well and indicates that pit growth below the limiting current density is limited by a combination of ohmic, concentration, and surface activation considerations. © 1992, The Electrochemical Society, Inc. All rights reserved.
Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials
J.C. Marinace
JES