Victor Valls, Panagiotis Promponas, et al.
IEEE Communications Magazine
IBM 90-nm silicon-on-insulator (SOI) technology was used for the key chips in the System z9™ processor chipset. Along with system design, optimization of some critical features of this technology enabled the z9™ to achieve double the system performance of the previous generation. These technology improvements included logic and SRAM FET optimization, mask fabrication, lithography and wafer processing, and interconnect technology. Reliability improvements such as SRAM optimization and burn-in reliability screen are also described. ©Copyright 2007 by International Business Machines Corporation.
Victor Valls, Panagiotis Promponas, et al.
IEEE Communications Magazine
Minkyong Kim, Zhen Liu, et al.
INFOCOM 2008
Robert G. Farrell, Catalina M. Danis, et al.
RecSys 2012
N.K. Ratha, A.K. Jain, et al.
Workshop CAMP 2000