Xinyi Su, Guangyu He, et al.
Dianli Xitong Zidonghua/Automation of Electric Power Systems
IBM 90-nm silicon-on-insulator (SOI) technology was used for the key chips in the System z9™ processor chipset. Along with system design, optimization of some critical features of this technology enabled the z9™ to achieve double the system performance of the previous generation. These technology improvements included logic and SRAM FET optimization, mask fabrication, lithography and wafer processing, and interconnect technology. Reliability improvements such as SRAM optimization and burn-in reliability screen are also described. ©Copyright 2007 by International Business Machines Corporation.
Xinyi Su, Guangyu He, et al.
Dianli Xitong Zidonghua/Automation of Electric Power Systems
S. Sattanathan, N.C. Narendra, et al.
CONTEXT 2005
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
Lerong Cheng, Jinjun Xiong, et al.
ASP-DAC 2008