Publication
IEEE Transactions on CPMT
Paper

Optical Transceiver Module for 1.2 Tb/s Based on Flexible Circuit Technology

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Abstract

We present a versatile electro-optical packaging platform for optical transceiver modules suitable for very high aggregate I/O capacity, as required, for example, in (disaggregated) datacenters and servers. Real-estate limitations on the board or on the processor package laminate are overcome by using a flexible printed circuit board substrate that is folded around a solid body, resulting in a 3-D package assembly. A 48 Gb/s × 10 Gb/s transceiver prototype is demonstrated as well as the design path toward a transceiver with 1.2-Tb/s aggregate I/O bandwidth. Accounting for large-scale manufacturing and deployment, we explicitly address the requirements of the optical, mechanical, thermal, and electrical interfaces as well as of all associated manufacturing processes.

Date

01 Aug 2017

Publication

IEEE Transactions on CPMT

Authors

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