PaperA High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump TechnologyK. Jackson, E.B. Flint, et al.Journal of Lightwave Technology
PaperCryogenic temperature mechanical behavior of solid mercuryS. Purushothaman, T. CaulfieldJournal of Applied Physics
Conference paperAGING RESPONSE AND CRYOGENIC MECHANICAL PROPERTIES OF AN In-Sn EUTECTIC SOLDER ALLOY FOR JOSEPHSON PACKAGING.T. Caulfield, S. Purushothaman, et al.International Cryogenic Materials Conference 1983
