Y. Kwark, P. Solomon, et al.
IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits 1989
The measured crosstalk characteristics for close-packed via fence enclosed differential stripline structures in a standard digital CMOS process are reported. The transmission lines achieve a packing pitch of 16 μm of interconnect width per differential pair. The nearest neighbour far-end differential crosstalk is measured to be better than -43 dB and the near-end differential crosstalk is better than -37 dB below the drive signal at frequencies up to 20 GHz for 600 μm lines. This is sufficient for use in high-density, high-speed analogue and digital integrated circuits. © IEE 2005.
Y. Kwark, P. Solomon, et al.
IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits 1989
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