OFC 2005
Conference paper

Novel packaging of parallel-optical interconnects for high-end servers


A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio <1.5x10-15 was measured at 8 Gb/s. © 2005 Optical Society of America.