Noninvasive picosecond ultrasonic detection of ultrathin interfacial layers: CF_x at the Al/Si interface

Abstract

A picosecond ultrasonics technique has been used to detect interfacial fluorocarbon (CFx) layers as thin as 0.5 nm between aluminum and silicon. The presence of the CFx material reduces acoustic damping and heat loss from the Al film into the Si substrate. This provides a means for noninvasive identification of organic/polymeric contaminants at the buried interface and potentially for characterizing interfacial mechanical properties.