P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Picosecond ultrasonic techniques were used to generate and detect acoustic pulses in bonded silicon-on-insulator structures. By simulating the shapes and amplitudes of the acoustic echoes reflected from the Si-SiO2 interfaces, we can characterize the physical properties of the interfaces. We have observed that via a further thermal annealing process one can change the interface quality of a poorly bonded structure. © 1998 The Electrochemical Society, Inc.
P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
U. Wieser, U. Kunze, et al.
Physica E: Low-Dimensional Systems and Nanostructures
Mitsuru Ueda, Hideharu Mori, et al.
Journal of Polymer Science Part A: Polymer Chemistry