Conference paper
Substrate engineering for germanium-based CMOS technology
S.W. Bedell, K.E. Fogel, et al.
ECS Meeting 2006
The aim of the SIMOX material development is at optimizing implant/annealing conditions which provide a thin BOX (≤ 2000 angstrom) and lower defects. It is believed that the annealing of low dose SIMOX would be very sensitive to the annealing ambient and this opens a new annealing parameter space for future low dose SIMOX work.
S.W. Bedell, K.E. Fogel, et al.
ECS Meeting 2006
T.S. Kuan, J. Freeouf, et al.
Journal of Applied Physics
J. Woodall, H.J. Hovel
Applied Physics Letters
K.L. Saenger, K.E. Fogel, et al.
Journal of Applied Physics