Conference paper
Cross-layer system resilience at affordable power
Meeta S. Gupta, Jude A. Rivers, et al.
IRPS 2014
One of the primary concerns for microprocessor designers has always been balancing power and thermal management while minimizing performance loss. Rather than generate solutions to this dilemma, the advent of multicore chips has raised a host of new challenges. This discussion with Pradip Bose and Kanad Ghose, excerpted from a 2007 CARD Workshop panel, explores the future of low-power design and temperature management. © 2007 IEEE.
Meeta S. Gupta, Jude A. Rivers, et al.
IRPS 2014
Tobias Webel, Preetham Lobo, et al.
IBM J. Res. Dev
Pradip Bose
Journal of Electronic Testing: Theory and Applications (JETTA)
Augusto Vega, Pradip Bose, et al.
HPCA 2012