ReviewThree-dimensional silicon integrationJohn U. Knickerbocker, Paul S. Andry, et al.IBM J. Res. Dev
PaperHeterostructure Devices Using Self-Aligned p-Type Diffused Ohmic ContactsSandip Tiwari, Alyce Ginzberg, et al.IEEE Electron Device Letters
PaperOptimization of extrinsic TFT mobility on 550 mm × 650 mm large glassM. Takeichi, S. Takahashi, et al.Vacuum
PaperEmpirical fit to band discontinuities and barrier heights in III-V alloy systemsSandip Tiwari, David J. FrankApplied Physics Letters