R.T. Hodgson, R.W. Dreyfus
Physics Letters A
The first use of an intense pulsed ion beam to anneal ion-implanted semiconductors is reported. Helium ion channeling shows that a single 80-ns pulse 200-keV H+ ions at ∼100 A/cm2 produced good crystallinity in silicon implanted with 1014 As/cm2 at 100 keV.
R.T. Hodgson, R.W. Dreyfus
Physics Letters A
J.E.E. Baglin, F.M. d'Heurle
JES
C.F. Dewey, W.R. Cook, et al.
IEEE JQE
R.T. Hodgson, G.S. Boebinger, et al.
Applied Physics Letters