D.J. Robbins, C. Falcony, et al.
IEEE Electron Device Letters
An infrared imaging system has been used to measure the thermal response of the print head electrodes during resistive ribbon thermal transfer printing. This has proved to be an effective method for fast, non-contact, high spatial resolution temperature measurements, providing valuable information on the thermal stress upon the head materials and on the amount of energy flowing into the head during printing.
D.J. Robbins, C. Falcony, et al.
IEEE Electron Device Letters
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Proceedings of SPIE 1989
R. Lane, R. John
Electronic Imaging: Advanced Devices and Systems 1990
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Journal of Applied Physics