Publication
ASMC 2020
Conference paper

Impact of process chambers exhaust on wafer defectivity in wet clean tools

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Abstract

The published paper will discuss the impact of exhaust pressure and velocity on particle performance in wet clean process chambers. Correlations are drawn from chamber exhaust pressure, exhaust velocity, and exhaust duct condition to explain the observed degradation in particle performance. Based on the observations, key solutions including periodic preventative maintenance on exhaust duct lines, chamber wipe downs, exhaust rebalancing are recommended to improve chamber stability and particle performance.

Date

01 Aug 2020

Publication

ASMC 2020

Authors

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