I.D. Sawing of silicon crystal in different lubricant environments

Abstract

The chemomechanical effect of lubricant environments on the I.D. sawing induced surface damage in Si crystal was tested in water and in an aqueous solution of a commercial coolant by applying different potentials on the Si crystal. Variations in thicknesses and surface morphologies of Si wafers sawn in different environments suggested smaller saw blade vibration in the coolant than in water. The density of sawing induced defects and the thickness of the damaged surface layer are also less when sawing is done in the coolant. The application of negative potential on Si crystal during the sawing was found to produce less surface damage than the application of positive potential. These results indicated that the fracture behavior and/or the frictional property of Si surface are environment-sensitive. © 1982 The Japan Society of Applied Physics.