Shigeru Nakagawa
ACPC 2009
Chip-level optical packaging on a waveguide-integrated surface laminar circuit (SLC) provides a promising solution for high-density and low-power I/O in future high-performance computing systems. We developed and demonstrated a high performance optical multi-chip module which consists of an FPGA with 12-channel optical I/O on a waveguide-integrated SLC that operates at data rate over 6 Gb/s per channel. ©2010 IEEE.
Shigeru Nakagawa
ACPC 2009
Jean Benoit Héroux, Tomofumi Kise, et al.
Journal of Lightwave Technology
Yoichi Taira, Hidetoshi Numata, et al.
ECTC 2010
Masao Tokunari, Hsianghan Hsu, et al.
ICSJ 2015