Publication
IEEE T-ED
Paper

Heat Transfer in Forced Convection Through Fins

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Abstract

A novel structure for cooling silicon chips involving passage of water through fins etched in the back of the chips has recently been described in the literature. The properties of silicon and the nature of the structure are such that approximations that allow an analytic solution to the heat transfer problem in the structure can be introduced. Formulas for the fin and channel dimensions that provide optimum cooling under various conditions can then be derived. The results are also presented in graphical form and by means of examples. © 1984 IEEE

Date

01 Jan 1984

Publication

IEEE T-ED

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