Flip Chip Joining with Injection Molded Solder Technology

Abstract

IBM has developed injection molded solder (IMS) technology in which the molten solder is used to form micro solder bumps. IMS has various technical advantages such as flexibility in the selection of solder alloy compositions, chemical-free soldering process and void-free bumping process. In this paper, the basic mechanism of IMS bumping, processes of solder bumping and chip joining and some of the results of reliability stress tests are discussed.