Fiber optic modules for high speed computer networks

Abstract

Optical networks for high-performance processors will benefit from an optoelectronic integrated circuit (OEIC) technology with high speed, high circuit density, and low power consumption. These chips should be packaged in small, card-mountable modules, compatible with arrays of fiber-optic lines. Fiber-optic technology options for this application are discussed. Results are presented for transmitter and receiver modules containing OEICs with 6-10K transistors per chip, 1-Gb/s performance, and 400-800 mW per chip heat generation. The modules are fabricated using GaAs MESFET technology and GaAlAs quantum-well-laser arrays and packaged using multilayered polyimide/metal/Si carriers.