S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999
In this paper, a skin-effect modeling approach is presented that is suitable for all frequency regimes of interest and therefore is most appropriate for transient interconnect analysis. Yet, the new formulation lends itself to a model that can be abstracted for use in conjunction with surface integral and finite difference-based electromagnetic tools for interconnect modeling. While a volume filament technique is not computationally feasible at high frequencies, where a fine discretization is necessary, the formulation that is presented avoids this difficulty by carefully casting the behavior of a conductor into the form of a global surface impedance, thus requiring fewer unknowns. Several examples illustrating the ability of the proposed model to accurately capture proximity and skin-effect behaviors will be shown. Interconnect resistance and inductance per-unit-length results are given and compared with those obtained using different models.
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
A.B. McLean, R.H. Williams
Journal of Physics C: Solid State Physics
Imran Nasim, Melanie Weber
SCML 2024