Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Grain boundary electrotransport of copper and silver atoms in copper + 1·2 at.% silver thin film conductors has been found to take place in opposite directions; the copper atoms migrate against the direction of electron flow, while the silver atoms migrate along this direction. It is shown that both the transport directions of the copper and the silver atoms can be qualitatively interpreted in terms of the existing theories of electromigration. © 1974 Peragamon Press.
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
G. Will, N. Masciocchi, et al.
Zeitschrift fur Kristallographie - New Crystal Structures
A.B. McLean, R.H. Williams
Journal of Physics C: Solid State Physics