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Publication
IEEE Topical Meeting EPEPS 2006
Conference paper
Distortion minimization for packaging level interconnects
Abstract
We propose a novel high-speed serial signaling scheme that minimizes the distortion for multichip module (MCM) packaging level communication by intentionally adding leakage resistors between the signal trace and the ground. The new scheme is inspired by the theory of distortionless transmission line which states that if R/G=L/C, there will be no distortion at the receiver end and the signal propagates at the speed of light. The simulation results indicate that, using the shunt resistor scheme. 10+ Gbps bit rate is achievable over a 10 cm single-ended stripline without pre-emphasis or equalization. © 2006 IEEE.