IEEE Topical Meeting EPEPS 2006
Conference paper

The use of fast integral equations solvers for practical package and interconnect analysis

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Fast integral equation methods are now being applied to packaging and other such "low frequency" problems. This paper explores some of the issues surrounding such an application to real, product level packaging and interconnect type structures. Discussed are issues such as low frequency breakdown, mesh aspect ratios, and solver convergence. Finally, integral equation solver examples are presented using the IBM internally developed pre-corrected FFT (PFFT) solver labeled EMSurf[l]. ©2006 IEEE.