Conference paper
Adhesion test standardization for multichip module packages
D.Y. Shih, J. Kim, et al.
ECTC 1995
Tensile testing of materials that freeze at subambient temperatures usually requires casting of the material in a mold, transferring the cast specimen into precooled test fixtures held in a moisture-free environment to avoid frosting, followed by performing the test at the desired cryogenic temperature. In this report we describe a device that allows the casting as well as testing to be completed in one assembly and cool-down cycle, eliminating the cumbersome intermediate steps.
D.Y. Shih, J. Kim, et al.
ECTC 1995
C. Narayan, S. Purushothaman
IEMT 1993
A.C. Callegari, B.K. Furman, et al.
ESSDERC 1992
F. Liu, R.R. Yu, et al.
IEDM 2008