Parametric study on the effect of asymmetry in multi-channel differential signaling
- Ki Jin Han
- Xiaoxiong Gu
- et al.
- 2011
- EMC 2011
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Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
- Biancun Xie
- Madhavan Swaminathan
- et al.
- 2011
- EMC 2011