Chidanand Apté, Fred Damerau, et al.
ACM Transactions on Information Systems (TOIS)
As semiconductor devices decrease in size, soft errors are becoming a major issue that must be addressed at all stages of product definition. Even before prototype silicon chips are available for measuring, modeling must be able to predict soft-error rates with reasonable accuracy. As the technology matures, circuit test sites are produced and experimentally tested to determine representative fail rates of critical SRAM and flip-flop circuits. Circuit models are then fit to these experimental results and further test-site and product circuits are designed and modeled as needed. © Copyright 2008 by International Business Machines Corporation.
Chidanand Apté, Fred Damerau, et al.
ACM Transactions on Information Systems (TOIS)
Indranil R. Bardhan, Sugato Bagchi, et al.
JMIS
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
Rajiv Ramaswami, Kumar N. Sivarajan
IEEE/ACM Transactions on Networking