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As semiconductor devices decrease in size, soft errors are becoming a major issue that must be addressed at all stages of product definition. Even before prototype silicon chips are available for measuring, modeling must be able to predict soft-error rates with reasonable accuracy. As the technology matures, circuit test sites are produced and experimentally tested to determine representative fail rates of critical SRAM and flip-flop circuits. Circuit models are then fit to these experimental results and further test-site and product circuits are designed and modeled as needed. © Copyright 2008 by International Business Machines Corporation.
Hans Becker, Frank Schmidt, et al.
Photomask and Next-Generation Lithography Mask Technology 2004
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