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Publication
ISTFA 2003
Conference paper
Characterization of Interconnect Defects due to Electromigration using Scanning Thermal Microscopy
Abstract
In this paper, the temperature distributions around interconnect defects due to electromigration are presented. A method to overlay the temperature distribution over the optical microscope image of the physical defect has also been developed. This allows a direct correlation of the temperature distribution and the physical structure of the defect.