Publication
IEEE MWCL
Paper

Antenna-in-Package Integration for a Wide-Band Scalable 5G Millimeter-Wave Phased-Array Module

IEEE MWCL
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Abstract

This work introduces a multi-layered organic package with embedded antennas that enables the integration of a scalable wide-band phased array module supporting the n257, n258, and n261 5G frequency bands (24.25–29.5 GHz). The package comprises (1) an 8×8 array of dual-polarized antenna elements with 5.1-mm spacing, (2) RF, IF, DC, and digital interconnects to support RFICs, filters and combiners, and (3) a ball-grid array; it is implemented in a compact 42.5 mm×42.5 mm×1.65 mm form factor. The design achieves wideband operation with minimal cost or complexity overhead (e.g. air cavities or additional substrates) by integrating a novel magneto-electric dipole antenna in the package. Direct probing and radiation pattern measurements of three antenna variants in two prototype antenna array packages demonstrate > 6-GHz bandwidth with 0-5 dBi gain. Measurement results for associated liquid crystal polymer-based band-pass filters and power combiners are also presented.

Date

01 Jan 2021

Publication

IEEE MWCL

Authors

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