Publication
ASMC 2021
Conference paper

A holistic characterization methodology for stochastic printing failures in EUV contact holes

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Abstract

A characterization approach has been developed for evaluating stochastic printing failures in EUV contact holes. Demand for consistent yield exceeding 10 billion contacts requires robust process co-optimization with a focus on stochastic defect reduction throughout the patterning process flow. To monitor and quantify failure rates across process points, implementation of a holistic approach for accurate and high-throughput methodologies is proposed.

Date

10 May 2021

Publication

ASMC 2021

Authors

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