Dzung Phan, Vinicius Lima
INFORMS 2023
We present a LiNbO3 integrated photonic platform with wafer-scale bonding to a Si3N4 photonic circuit. The platform exhibits <0.1 dB/cm propagation loss and <2.5 dB/facet fiber-chip coupling loss. We demonstrate phase shifters, frequency-agile lasers, optical splitters, and other devices.
Dzung Phan, Vinicius Lima
INFORMS 2023
Jehanzeb Mirza, Leonid Karlinsky, et al.
NeurIPS 2023
Hagen Soltau, Lidia Mangu, et al.
ASRU 2011
Liya Fan, Fa Zhang, et al.
JPDC