PaperOn boundary conditions in lattice Boltzmann methodsShiyi Chen, Daniel Martínez, et al.Physics of Fluids
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
TalkEnhanced Room Temperature Photoluminescence Quantum Yield in Morphology-Controlled J-AggregatesSurendra B. Anantharaman, Joachim Kohlbrecher, et al.MRS Fall Meeting 2020
Conference paperSelf-assembling materials for lithographic patterning: Overview, status and moving forwardWilliam Hinsberg, Joy Cheng, et al.SPIE Advanced Lithography 2010
