J.R. Lloyd, C.E. Murray, et al.
Microelectronics Reliability
Paper
A comparison of grain size measurements in Al-Cu thin films: Imaging verses diffraction techniques
Abstract
No abstract available.
Related
Juliano Borges, Hongwen Yan, et al.
SPIE Advanced Lithography 2024
D.B. Knorr, D.P. Tracy, et al.
Applied Physics Letters
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999