Development of high conductivity lead (Pb)-free conducting adhesives
- Sung K. Kang
- Rajinder S. Rai
- et al.
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
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5 results at IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys
- N.R. Bonda
- I.C. Noyan
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Intrinsic Thermocouple Monitor for Laser Wirebonding
- Brian W. Hussey
- Gnanalingam Arjavalingam
- et al.
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
A Practical Excimer Laser-Based Cleaning Tool For Removal Of Surface Contaminants
- Andrew C. Tarn
- Costas P. Grigoropoulos
- 1994
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
A Fully Integrated Planar Toroidal Inductor With A Micromachined Nickel-Iron Magnetic Bar
- Yong J. Kim
- Mark G. Allen
- 1994
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
