Publications

4 results at IITC 2025

First Demonstration of 16nm Pitch Subtractive Ru Interconnects for Advanced Technology Nodes
- - C. Penny
  - K. Motoyama
  - et al.
- 2025
- IITC 2025
Reliability and Performance Enhancement for Fully Subtractive Ru Topvia Interconnects
- - Koichi Motoyama
- 2025
- IITC 2025
Predictive Simulations and Experimental Study of AlN Bonding for Better Thermal Dissipation in BSPDN
- - Sarabjot Singh
  - Sangshin Jang
  - et al.
- 2025
- IITC 2025
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- - D. Edelstein
  - A. Jog
  - et al.
- 2025
- IITC 2025