Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration PackagingFrank LibschSteve Bedellet al.2024ECTC 2024
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI HardwareDivya TanejaJonathan Grenieret al.2024ECTC 2024
Laser Attach Process Development and material selectionAlexander Janta-PolczynskiElaine Cyret al.2024ECTC 2024
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder JointsAkihiro HoribeTakahito Watanabeet al.2024ECTC 2024
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid BondingSari ZereyJunghyun Choet al.2024ECTC 2024