Nano electro-machining (nano-EM): A novel method for sculpting nano vias (< 20 nm) for nanoscale packaging
- Ajay P. Malshe
- Kumar R. Virwani
- et al.
- 2008
- IMAPS 2008
Conference paper
Publications
4 results at IMAPS 2008
Cooling rate dependent underfill fracture toughness
- Soojae Park
- Claudius Feger
- et al.
- 2008
- IMAPS 2008
Conference paperBEOL thermal characterization for 3-D packaging
- J. Wakil
- E.G. Colgan
- et al.
- 2008
- IMAPS 2008
Conference paperThermal aging of laminate materials and the maximum use temperature of organic packages
- Laura L. Kosbar
- Claudius Feger
- et al.
- 2008
- IMAPS 2008
Conference paper