Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Conference paper
Publications
8 results at VMIC 2005
New spin-on oxycarbosilane low-k dielectric materials with exceptional mechanical properties
- Dubois Geraud
- Teddie Magbitang
- et al.
- 2005
- VMIC 2005
Conference paperStress migration reliability of copper interconnect stacked via structures with adjacent copper plates in low k- dielectrics
- D. Nguyen
- Kaushik Chanda
- et al.
- 2005
- VMIC 2005
Conference paperTiming derived current for signal net reliability assessment
- Jiedong Diao
- Jim Venuto
- et al.
- 2005
- VMIC 2005
Conference paperBEOL interconnects for 45 nm node and beyond
- R.R. Yu
- J. Doyle
- et al.
- 2005
- VMIC 2005
Conference paperMechanical and dielectric characterization of low-k, porous organosilicates
- Willi Volksen
- Teddie P. Magbitang
- et al.
- 2005
- VMIC 2005
Conference paperCMOS transistor processing compatible with monolithic 3-D integration
- B. Rajendran
- R.S. Shenoy
- et al.
- 2005
- VMIC 2005
Conference paperLower-k SiCOH integration for 65 nm ground rules
- T. Nogami
- S. Lane
- et al.
- 2005
- VMIC 2005
Conference paper