Publications

8 results at VMIC 2005

Assembly technology for three dimensional integrated circuits
- - A. Topol
  - D.C. La Tulipe
  - et al.
- 2005
- VMIC 2005
New spin-on oxycarbosilane low-k dielectric materials with exceptional mechanical properties
- - Dubois Geraud
  - Teddie Magbitang
  - et al.
- 2005
- VMIC 2005
Stress migration reliability of copper interconnect stacked via structures with adjacent copper plates in low k- dielectrics
- - D. Nguyen
  - Kaushik Chanda
  - et al.
- 2005
- VMIC 2005
Lower-k SiCOH integration for 65 nm ground rules
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- VMIC 2005
Timing derived current for signal net reliability assessment
- - Jiedong Diao
  - Jim Venuto
  - et al.
- 2005
- VMIC 2005
BEOL interconnects for 45 nm node and beyond
- - R.R. Yu
  - J. Doyle
  - et al.
- 2005
- VMIC 2005
Mechanical and dielectric characterization of low-k, porous organosilicates
- - Willi Volksen
  - Teddie P. Magbitang
  - et al.
- 2005
- VMIC 2005
CMOS transistor processing compatible with monolithic 3-D integration
- - B. Rajendran
  - R.S. Shenoy
  - et al.
- 2005
- VMIC 2005