Publications

DiffChip: Thermally Aware Chip Placement with Automatic Differentiation
- - Giuseppe Romano
  - Aakrati Jain
  - et al.
- 2025
- ECTC 2025
Conference paper
Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- - Sathya Raghavan
  - Ben Yang
  - et al.
- 2025
- ECTC 2025
Conference paper
Fully Encapsulated Fine Pitch Dual Damascene Organic RDL With Low Dk Df Photosensitive Polyimide and its Reliability
- - Minhua Lu
  - Joyce Liu
  - et al.
- 2025
- ECTC 2025
Conference paper
Fast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- - Prabudhya Roy Chowdhury
  - Aakrati Jain
  - et al.
- 2025
- ECTC 2025
Conference paper
Graphite Sheet Embedded in an Organic Flip-Chip Package for Heat Spreading
- - Keiji Matsumoto
  - Daisuke Oshima
  - et al.
- 2025
- ECTC 2025
Conference paper
Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- - John U. Knickerbocker
  - Jean Benoit Herou
  - et al.
- 2025
- ECTC 2025
Conference paper
Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- - Sari Al Zerey
  - Alina Bennett
  - et al.
- 2025
- ECTC 2025
Conference paper
The Power of Alternatives in Network Embedding
- - Oleg Kolosov
  - Gala Yadgar
  - et al.
- 2025
- INFOCOM 2025
Conference paper
Key Derivation Functions Without a Grain of Salt
- - Matilda Backendal
  - Sebastian Clermont
  - et al.
- 2025
- Eurocrypt 2025
Conference paper
POKE: A Compact and Efficient PKE from Higher-dimensional Isogenies
- - Andrea Basso
  - Luciano Maino
- 2025
- Eurocrypt 2025
Conference paper