Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- Minhua Lu
- Evan Colgan
- 2024
- ECTC 2024
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Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- Frank Libsch
- Steve Bedell
- et al.
- 2024
- ECTC 2024
Reliable Chiplet integration on high density laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Pouliot-Grenier
- et al.
- 2024
- ECTC 2024
Laser Attach Process Development and material selection
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2024
- ECTC 2024
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Witness Semantic Security
- Paul Lou
- Nathan Manohar
- et al.
- 2024
- Eurocrypt 2024
Taming subnet-drift in D2D-enabled fog learning: a hierarchical gradient tracking approach
- Evan Chen
- Shiqiang Wang
- et al.
- 2024
- INFOCOM 2024
Understanding and Bridging the Gap Between Unsupervised Network Representation Learning and Security Analytics
- Jiacen Xu
- Xiaokui Shu
- et al.
- 2024
- S&P 2024
Asterisk: Super-fast MPC with a Friend
- Banashri Karmakar
- Nishat Koti
- et al.
- 2024
- S&P 2024