Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- - Hiroyuki Mori
  - Sayuri Kohara
- 2021
- ECTC 2021
Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- - Aakrati Jain
  - Kamal Sikka
  - et al.
- 2021
- ECTC 2021
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
- - Risa Miyazawa
  - Chinami Marushima
  - et al.
- 2021
- ECTC 2021
High Density Multi-Chip Module for Photonic Reservoir Computing
- - Jean Benoit Heroux
  - Toshiyuki Yamane
  - et al.
- 2021
- ECTC 2021
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- - Katsuyuki Sakuma
  - Dishit Parekh
  - et al.
- 2021
- ECTC 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- - Katsuyuki Sakuma
  - Mukta Farooq
  - et al.
- 2021
- ECTC 2021
Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- - Kamal Sikka
  - Ravi Bonam
  - et al.
- 2021
- ECTC 2021
Novel Phased Array Antenna-in-Package Development and Active Module Demonstration for 5G Millimeter-Wave Wireless Communication
- - Xiaoxiong Gu
  - Duixian Liu
  - et al.
- 2021
- ECTC 2021
Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
- - Keiji Matsumoto
  - Marc Bergendahl
  - et al.
- 2021
- ECTC 2021
Energy Efficiency Boost in the AI-Infused POWER10 Processor
- - Brian W. Thompto
  - Dung Q. Nguyen
  - et al.
- 2021
- ISCA 2021