The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
- Gregory Parks
- Babak Arfaei
- et al.
- 2012
- ECTC 2012
Publications
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Micro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
Terabit/sec 48-channel fiber-coupled optical module based on holey CMOS transceiver IC
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2012
- ECTC 2012
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Data centers in the cloud: A large scale performance study
- Robert Birke
- Lydia Y. Chen
- et al.
- 2012
- CLOUD 2012
VM placement strategies for cloud scenarios
- Nicolò Maria Calcavecchia
- Ofer Biran
- et al.
- 2012
- CLOUD 2012
Scheduling parallel tasks onto opportunistically available cloud resources
- Ting He
- Shiyao Chen
- et al.
- 2012
- CLOUD 2012