Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
Conference paper
Publications
Efficient parametric modeling and analysis for backplane channel characterization
- Xiaoxiong Gu
- Ki Jin Han
- et al.
- 2012
- ECTC 2012
Conference paperTerabit/sec 48-channel fiber-coupled optical module based on holey CMOS transceiver IC
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2012
- ECTC 2012
Conference paperThe dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
- Gregory Parks
- Babak Arfaei
- et al.
- 2012
- ECTC 2012
Conference paperSystematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
Conference paperWafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
Conference paperSupervised hashing with kernels
- Wei Liu
- Jun Wang
- et al.
- 2012
- CVPR 2012
Conference paperHand tracking by binary quadratic programming and its application to retail activity recognition
- Hoang Trinh
- Quanfu Fan
- et al.
- 2012
- CVPR 2012
Conference paperPreSET: Improving performance of phase change memories by exploiting asymmetry in write times
- Moinuddin K. Qureshi
- Michele M. Franceschini
- et al.
- 2012
- ISCA 2012
Conference paperConstructing parser for industrial software specifications containing formal and natural language description
- Futoshi Iwama
- Taiga Nakamura
- et al.
- 2012
- ICSE 2012
Conference paper