2D magnetic inductors for DC-DC converters on glass interposer
- Vincent Lafage
- Yann Beilliard
- et al.
- 2018
- ECTC 2018
Publications
Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch
- Jae Woong Nah
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Backward compatible connectors for next generation PCIe electrical I/O
- Lei Shan
- Daniel Freidman
- et al.
- 2018
- ECTC 2018
An Enhanced 64-Element Dual-Polarization Antenna Array Package for W-Band Communication and Imaging Applications
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2018
- ECTC 2018
Laser Sintering of Dip-Based All-Copper Interconnects
- Luca Del Carro
- Martin Kossatz
- et al.
- 2018
- ECTC 2018
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- Qianwen Chen
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Swing: Swarm computing for mobile sensing
- Songchun Fan
- Theodoros Salonidis
- et al.
- 2018
- ICDCS 2018
How to prevent skynet from forming (A perspective from policy-based autonomic device management)
- Seraphin Calo
- Dinesh Verma
- et al.
- 2018
- ICDCS 2018
AdaptiveConfig: Run-time configuration of cluster schedulers for cloud short-running jobs
- Rui Han
- Zan Zong
- et al.
- 2018
- ICDCS 2018
Benchmarking deep learning frameworks: Design considerations, metrics and beyond
- Ling Liu
- Yanzhao Wu
- et al.
- 2018
- ICDCS 2018