Publications

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- - Chinami Marushima
  - Toyohiro Aoki
  - et al.
- 2022
- ECTC 2022
Conference paper
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- - Prabudhya Roy Chowdhury
  - Katsuyuki Sakuma
  - et al.
- 2022
- ECTC 2022
Conference paper
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- - Keiji Matsumoto
  - Takahito Watanabe
  - et al.
- 2022
- ECTC 2022
Conference paper
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2022
- ECTC 2022
Conference paper
Sine Series Approximation of the Mod Function for Bootstrapping of Approximate HE
- - Charanjit Jutla
  - Nathan Manohar
- 2022
- Eurocrypt 2022
Conference paper
Practical Non-interactive Publicly Verifiable Secret Sharing with Thousands of Parties
- - Craig Gentry
  - Shai Halevi
  - et al.
- 2022
- Eurocrypt 2022
Conference paper
Fantastic Questions and Where to Find Them: FairytaleQA–An Authentic Dataset for Narrative Comprehension
- - Ying Xu
  - Dakuo Wang
  - et al.
- 2022
- ACL 2022
Conference paper
Quality Controlled Paraphrase Generation
- - Elron Bandel
  - Ranit Aharonov
  - et al.
- 2022
- ACL 2022
Conference paper
It is AI's Turn to Ask Humans a Question: Question-Answer Pair Generation for Children's Story Books
- - Bingsheng Yao
  - Dakuo Wang
  - et al.
- 2022
- ACL 2022
Conference paper
On The Ingredients of an Effective Zero-shot Semantic Parser
- - Pengcheng Yin
  - John Wieting
  - et al.
- 2022
- ACL 2022
Conference paper