Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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11 results for Soojae Park

Underfill acceleration factor based on thermal fatigue crack growth rate
- - Soojae Park
  - Claudius Feger
  - et al.
- 2010
- ECTC 2010
Direct measurement of local stress in first-level flip-chip organic packages
- - Ijeoma Nnebe
  - Soojae Park
  - et al.
- 2010
- ECTC 2010
Crack growth rate of thermally induced underfill fatigue
- - Soojae Park
  - Claudius Feger
- 2009
- ECTC 2009
Underfill fracture toughness as a function of cooling rate
- - Soojae Park
  - Claudius Feger
- 2008
- ECTC 2008
Thermal aging of laminate materials and the maximum use temperature of organic packages
- - Laura L. Kosbar
  - Claudius Feger
  - et al.
- 2008
- IMAPS 2008
Cooling rate dependent underfill fracture toughness
- - Soojae Park
  - Claudius Feger
  - et al.
- 2008
- IMAPS 2008
Characterization of the viscoelastic properties of gore® 5510 proton exchange membrane
- - Kshitish Patankar
  - David Dillard
  - et al.
- 2007
- SEM Annual Conference on Experimental and Applied Mechanics 2007
Using single-wall carbon nanotubes and raman spectroscopy to measure local stresses in first-level flip-chip organic packages
- - Ijeoma Nnebe
  - Soojae Park
  - et al.
- 2011
- IEEE Transactions on CPMT
Thermal fracture toughness measurement for underfill during temperature change
- - Soojae Park
  - Claudius Feger
- 2011
- Microelectronics Reliability
Development of a simple mixed-mode fracture test and the resulting fracture energy envelope for an adhesive bond
- - Soojae Park
  - David A. Dillard
- 2008
- International Journal of Fracture