Underfill acceleration factor based on thermal fatigue crack growth rate
- Soojae Park
- Claudius Feger
- et al.
- 2010
- ECTC 2010
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11 results for Soojae Park
Direct measurement of local stress in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2010
- ECTC 2010
Crack growth rate of thermally induced underfill fatigue
- Soojae Park
- Claudius Feger
- 2009
- ECTC 2009
Underfill fracture toughness as a function of cooling rate
- Soojae Park
- Claudius Feger
- 2008
- ECTC 2008
Thermal aging of laminate materials and the maximum use temperature of organic packages
- Laura L. Kosbar
- Claudius Feger
- et al.
- 2008
- IMAPS 2008
Cooling rate dependent underfill fracture toughness
- Soojae Park
- Claudius Feger
- et al.
- 2008
- IMAPS 2008
Characterization of the viscoelastic properties of gore® 5510 proton exchange membrane
- Kshitish Patankar
- David Dillard
- et al.
- 2007
- SEM Annual Conference on Experimental and Applied Mechanics 2007
Using single-wall carbon nanotubes and raman spectroscopy to measure local stresses in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2011
- IEEE Transactions on CPMT
Thermal fracture toughness measurement for underfill during temperature change
- Soojae Park
- Claudius Feger
- 2011
- Microelectronics Reliability
Development of a simple mixed-mode fracture test and the resulting fracture energy envelope for an adhesive bond
- Soojae Park
- David A. Dillard
- 2008
- International Journal of Fracture