EUV OPC for 56 nm metal pitch
- Martin Burkhardt
- Matt Colburn
- et al.
- 2011
- SPIE Advanced Lithography 2011
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3 results for Yi Zou
Overcoming the challenges of 22-nm node patterning through litho-design co-optimization
- Martin Burkharde
- J.C. Arnold
- et al.
- 2009
- SPIE Advanced Lithography 2009
32 NM Logic patterning options with immersion lithography
- K. Lai
- S. Burns
- et al.
- 2008
- SPIE Advanced Lithography 2008