Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
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Fabrication and performance limits of sub-0.1 μm Cu interconnects
- T.S. Kuan
- C.K. Inoki
- et al.
- 2000
- Materials Research Society Symposium-Proceedings
Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching
- Y. Hsu
- T. Standaert
- et al.
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures