Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
- Xin Zhao
- Michael Scheuermann
- et al.
- 2012
- DAC 2012
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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3 results for Xin Zhao
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs
- Xin Zhao
- Yang Wan
- et al.
- 2013
- ICCAD 2013
Analysis and modeling of dc current crowding for tsv-based 3-d connections and power integrity
- Xin Zhao
- Michael R. Scheuermann
- et al.
- 2014
- IEEE Transactions on CPMT