D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
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AFM Assisted Hybrid Bonding Interface Optimization
- Nick Polomoff
- Jennifer Fullam
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025